What is Manufacture Android Motherboard PCBA Assembly
Price
Purchase Qty. Reference FOB Price
1-99 Pieces US$10.00
100-999 Pieces US$0.80
1,000-9,999 Pieces US$0.60
10,000+ Pieces US$0.03
Sepcifications
- Type Rigid Circuit Board
- Dielectric FR-4
- Material Fiberglass Epoxy Resin + Polyimide Resin
- Application Consumer Electronics
- Flame Retardant Properties V2
- Mechanical Rigid Rigid
- Processing Technology Electrolytic Foil
- Base Material Copper
- Insulation Materials Epoxy Resin
- Brand New Chip
- Transport Package Foam Packing
- Specification FR4 1-4 Layers
- Trademark New Chip
- Origin China
- Capacity 1000000
- OEM/ODM Available
- Sample Available
- Surface Treatment OSP, Enig, HASL, AG Immersion
- Certificate Gurantee Yes
- Test 100%E-Testing
- Min Bonding Pad Diameter 10mil
- Min Thickness of Soldermask 10um
- Color of Silk-Screen White, Yellow, Black
- Data File Format Gerber File and Drilling File
- Material for PCB Fr-4, High Tg Fr$, Halogen Free
- Layer Count 1-20 Layers
- Shipping DHL/UPS/FedEx/Air/Sea
Product Description
Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...
