| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design, Engineering Support, Testing;
Specialised: Medical, Industrial, Communication, Controlboard;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
Surface Finishing: Enig, OSP, AG, Immersion Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black, Yellow, Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
PCB Copper Thickness: 1.6mm;
PCB Material Thickness: Fr4;
PCB Silkscreen: White;
PCB Solder Mask: White, Black, Red;
PCB Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
PCB Copper Thickness: 1.6mm;
PCB Material Thickness: Fr4;
PCB Silkscreen: White;
PCB Solder Mask: White, Black, Red;
PCB Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Copper Thickness: 1oz;
Certificates: UL, RoHS, SGS, ISO9001;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Xjy;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
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