What is Optimized Multilayer PCB Design for High-Efficiency Power Conversion
Price
Min. Order Reference FOB Price
1 Set US$0.30-20.00 / Set
Sepcifications
- Type Combining Rigid Circuit Board
- Dielectric FR-4
- Material Fiberglass Epoxy
- Application Aerospace
- Flame Retardant Properties V0
- Mechanical Rigid Rigid
- Processing Technology Electrolytic Foil
- Base Material Copper
- Insulation Materials Organic Resin
- Transport Package Carton
- Specification customized
- Trademark Hub
- Origin China
- Customization Customized
- MOQ 1 Piece
- Application Industry Medical Control
- Conductor Material Tinned Copper Bare Copper
- Surface Finish Lead Free HASL
- Assembly Type SMT
- Component Sourcing Factory Sourcing
- Firmware Programming Supported
- Certifications ISO9001, IATF16949, ISO13485, CE, RoHS
- Lead Time 2 to 5 Days for Samples, 7 To15 Days for Mass
- Flame Retardant Grade V0
- Min. Line/Space Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to
- Impedance Control Support
- Current Carrying Depends on Copper Weight; 1oz for Signal/Medium Po
Product Description
Product Description Rigid-Flex PCB Technical Specification Layer 1-30 layers Finish Board Thickness 0.25-6.0mm Min Pattern Width / Spacing 0.05mm/0.05mm Max Finish Board Size 230*450mm Finish Board Thickness Tolerance ±50.05mm PP Thickness 12.5um/25um/50um Copper Thickness 12um/18um/36um/70um ...
