| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
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Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
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Type: Rigid Circuit Board;
Dielectric: High Speed Low Loss (Megtron 6 / It-968 / Tu-872);
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yuwei;
Product Name: HDI PCB;
Keywords: HDI PCB for 800g Optical Transceiver;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc.;
Silkscreen Color: White, Yellow, Black, etc;
Small Hole Size: 0.075mm;
Layer Count: 4-16L;
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Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
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Type: LED Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4, Polyimide, Aluminum;
Insulation Materials: Organic Resin;
Board Type: Rigid, Flex, Rigid-Flex PCB;
Layer Count: 1 - 32 Layers;
Board Thickness: 0.2 mm - 3.2 mm;
Board Thickness Tolerance: ±10% (Min ±0.03 mm);
Finished Copper Weight: 0.5 Oz - 6.0 Oz (18-210 μm);
Min Line Width / Space: 0.05 mm / 0.05 mm (2 Mil);
Min Hole Size: 0.15 mm (6 Mil);
Surface Finish: Enig, HASL, OSP, Immersion Silver;
Solder Mask Color: Green, Blue, Black, White, Red;
Impedance Control: ±8% (50 ω, 100 ω Differential);
Operating Temperature Range: -40 °C to +130 °C;
Flammability Rating: UL 94V-0;
Dielectric Constant (Dk): 3.8 - 4.5 @ 1 GHz;
Testing Standard: 100% Aoi & Flying Probe Test;
Certifications: ISO 9001, IATF 16949, UL, RoHS;
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