| Specification |
Type: LED Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4, Polyimide, Aluminum;
Insulation Materials: Organic Resin;
Board Type: Rigid, Flex, Rigid-Flex PCB;
Layer Count: 1 - 32 Layers;
Board Thickness: 0.2 mm - 3.2 mm;
Board Thickness Tolerance: ±10% (Min ±0.03 mm);
Finished Copper Weight: 0.5 Oz - 6.0 Oz (18-210 μm);
Min Line Width / Space: 0.05 mm / 0.05 mm (2 Mil);
Min Hole Size: 0.15 mm (6 Mil);
Surface Finish: Enig, HASL, OSP, Immersion Silver;
Solder Mask Color: Green, Blue, Black, White, Red;
Impedance Control: ±8% (50 ω, 100 ω Differential);
Operating Temperature Range: -40 °C to +130 °C;
Flammability Rating: UL 94V-0;
Dielectric Constant (Dk): 3.8 - 4.5 @ 1 GHz;
Testing Standard: 100% Aoi & Flying Probe Test;
Certifications: ISO 9001, IATF 16949, UL, RoHS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 0.5 Oz-6 Oz;
Board Layer: 1-20 Layer;
Board Thickness: 0.3mm-3.0mm;
Max PCB Size: 600*600mm;
Surface Finish: Enig;
Solder Mask: Yellow;
Others: Gold Finger;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Outer Copper Thickness: 1 Oz;
Board Layer: 4 Layer;
Board Thickness: 1.6mm;
Inner Copper Thickness: 2oz;
Surface Finish: OSP;
Solder Mask: Blue;
Legend: White;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 0.5 Oz-6 Oz;
Board Layer: 1- 32layer;
Board Thickness: 0.3mm-3.0mm;
Max PCB Size: 600*600mm;
Surface Finish: HASL, Enig, Immersion Silver, Immersion Tim;
Solder Mask: Green, Blue, White, Black, Red;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 0.5 Oz-6 Oz;
Board Layer: 1-20 Layer;
Board Thickness: 0.3mm-3.0mm;
Max PCB Size: 600*600mm;
Surface Finish: HASL, Enig, Immersion Gold, Immerions Tin, OSP;
|