| Specification |
Metal Coating: Copper;
Mode of Production: SMT&Pth&BGA&DIP&Box Buliding;
Layers: Multilayer;
Base Material: Cem-1, Cem-3 Fr-4, Fr-4 High Tg, Aluminum Base Mat;
Customized: Customized;
Condition: Used;
Flame Retardant Properties: V0;
PCBA-Testing: Aoi, X-ray, Ict,Fct;
Small Order: Accepted;
IC Burn Program: Reprogramming;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
PCB Layers: Single Layer, Double Layer, 4 Layers, 6 Layers, 8;
Substrate Material: Fr-4 Tg130, Fr-4 Tg150, Fr-4 Tg180, Aluminum PCB,;
Board Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm;
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