| Specification |
Conductive Type: Bipolar Integrated Circuit;
Integration: GSI;
Output Type: Current Output;
Resolution: 10 Bit;
Shape: DIP;
Technics: Semiconductor IC;
Typical Applications: Level Signal Measurement, Monitoring, and Control;
Typical Applications1: RS-485 Remote I/O, Data Acquisition;
Typical Applications2: Intelligent Building Control, Security Engineering;
Typical Applications3: RS-232/485 Bus Industrial Automation Control Syst;
Typical Applications4: Equipment Operation Monitoring and Control;
Typical Applications5: Measurement of Sensor Signals;
Typical Applications6: Acquisition and Recording of Industrial Field Data;
Typical Applications7: Switch Signal Acquisition;
|
Output Type: Voltage or Current - Buffered;
Technics: Thick Film IC;
Number of Bits: 16;
Number of D/a Converters: 1;
Settling Time: 25µs (V), 40µs (a) (Typ);
Differential Output: No;
Data Interface: Spi, DSP;
Reference Type: External, Internal;
Voltage - Supply, Analog: 10.8V ~ 40V, -3V ~ 26.4V;
Voltage - Supply, Digital: 2.7V ~ 5.5V;
Inl/Dnl (Lsb): -, ±1.3 (Max);
Architecture: R-2r;
Operating Temperature: -40°c ~ 105°c;
Package / Case: 24-Tssop (0.173", 4.40mm Width) Exposed Pad;
Supplier Device Package: 24-Tssop-Ep;
Base Product Number: Ad5422;
shape: SMD;
|
Output Type: Voltage - Buffered;
Resolution: 12 Bit;
Number of Bits: 12;
Number of D/a Converters: 1;
Settling Time: 5µs;
Differential Output: No;
Data Interface: Spi, DSP;
Reference Type: External;
Voltage - Supply, Analog: 2.7V ~ 5.5V;
Voltage - Supply, Digital: 2.7V ~ 5.5V;
Inl/Dnl (Lsb): ±0.35, ±0.08;
Architecture: String Dac;
Operating Temperature: -40°c ~ 105°c;
Package / Case: 12-Ufdfn Exposed Pad;
Supplier Device Package: 12-Uson (3X2);
Base Product Number: 12-Uson (3X2);
|
Conductive Type: Standard;
Integration: Standard;
Technics: Semiconductor IC;
shape: Standard;
|
Conductive Type: Standard;
Integration: Standard;
Technics: Standard;
shape: Standard;
|