| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: All Kinds of Industries;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Unice;
Layer: 1-20;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Red/Blue/White/Black/Yellow/ etc;
Surface Finish: HASL/HASL Lead Free/OSP/Immersion Gold/Tin/ Silv;
Min Hole Size: 0.2mm;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Packing: Vacuum Package;
Service: One-Stop Service;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Aluminum Covered Copper Foil Layer;
Application: LED;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper Substrate PCB;
Insulation Materials: Organic Resin;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper Substrate PCB;
Insulation Materials: Organic Resin;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper Substrate PCB;
Insulation Materials: Organic Resin;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
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