| Specification |
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Solder Mask Color: White;
Finished Copper Thickness: 35um;
PCB Testing: Flying Probe Testing/E-Testing;
Lead Time: 7 Working Days;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
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Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
|
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
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