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PCBA
US$2.00-2.80 / PCS
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What is High Quality Good Customer Service Custom Electronic Assembly PCB PCBA Circuit Electronic Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 PCS US$2.80

10-99 PCS US$2.50

100+ PCS US$2.00

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Ucreate PCB
  • Origin Shenzhen
  • Board Layer 10 L
  • Surface Finihsing Immersion Gold
  • Lead Time 6-8 Working Days
  • Board Thickness 0.5mm-7.0mm
  • Material Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers
  • Max Panel Size 32"×48"(800mm×1200mm)
  • Min Hole Size 0.02mm
  • Min Line Width 3mil(0.075mm)
  • Copper Thickness 0.2-7.0oz
  • Soldermask Green/Yellow/Black/White/Red/Blue
  • Silkscreen Red/Yellow/Black/White
  • Min Pad 5mil(0.13mm)
  • Certificate UL,ISO 9001,ISO14001,IATF16949
  • Material Suppilers Shengyi, Kb, Nanya, Iteq,etc.

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow ...

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PCBA Comparison
Transaction Info
Price US$2.00-2.80 / PCS US$2.56-8.75 / Piece US$8.52-15.00 / Piece Negotiable US$2.40 / Piece
Min Order 1 PCS 10 Pieces 10 Pieces 1 Piece 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union T/T T/T T/T T/T
Quality Control
Product Certification UL,ISO 9001,ISO14001,IATF16949 ISO ISO RoHS, ISO, ISO13485,IATF16949 RoHS, CCC, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 10 L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Full Automatic One Stop Power Bank PCBA for USB Po;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier