| Specification |
Mode of Production: SMT/Thru-Hole;
Layers: 1 - 32layers;
Customized: Customized;
Condition: New;
Thickness: No Limit;
Order Volume: No Limit;
Layer Stackup: All Stack-up;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 201;
Minimum IC Pin Spacing: 0.35mm;
Minimum BGA Spacing: 0.35mm(Center to Center);
Reflow Temperature: 240+/-5 °C;
Spi: Yes;
Aoi: Yes;
Visual Inspection: Yes;
Build Time: 7-35 Days;
Function Test: Yes;
Conformal Coating: Yes;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Mx-M2;
Brand Name: MP3 Bluetooth Player;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz - 6.0oz;
Min. Hole Size: 6mil, 4mil-Laser Drill;
Surface Finishing: HASL, Nickle;
Application: Large, Medium and Small Projects;
Material: Fr4 /Aluminum/Ceramic Cem1;
PCB Standard: Ipc-a-610 D/Ipc-III Standard;
Layer: 1-32 Layers;
Package: Vacuum Package;
PCBA Service: SMD SMT DIP Component Assembly;
Color: Red Blue Green Black White;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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