| Specification |
Usage: Computer, Solar Lorawan® Gateway;
Type: Ultra Low Power;
Support Network: 4G/5g;
Information content: Data;
Condition: New;
CPU: Quad-Core 1.3 GHz, 64-Bit Arm Cortex-A35;
Memory: 512 MB DDR3 RAM;
Flash: 8 GB Emmc;
Extendable Storage: 1 × Micro SD Slot (Internal);
Antenna Connector: 1 × 50 Ω SMA Connector (Center Pin: Sm;
Channel: 8 (Half-Duplex);
Frequency Band: Cn470/In865/EU868/Ru864/Us915/Au915/Kr920/As923-1&;
Ingress Protection: IP30;
Installation: Desktop, Wall Mounting, DIN Rail Mountin;
Operating Temperature: -20°c to +60°c (-4° F to +140° F);
Storage Temperature: -40°c to +85°c (-40° F to +185° F);
Relative Humidity: 0% to 95% (Non-Condensing) at 25°c/77° F;
Power Input: 802.3 Af Poe 5V/2A by Type-C Port;
Power Consumption: Typical 1.8 W, Max 6.9 W;
Physical Layer: 10/100 Base-T (IEEE 802.3);
|
Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
|
Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
|
Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
|
Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
|
