| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 4L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 4L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 6L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi, High Tg, Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq, etc.;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 220±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C,B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
Application Scenarios: Used in Hotels Schools Hospitals and Workshops;
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