| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: G-10;
Customized: Customized;
Condition: Used;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: G-10;
Customized: Customized;
Condition: Used;
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Metal Coating: Silver;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Application: Electrical & Electronics Industry;
Platform Number: 1;
Max Move Speed: Y :600-800mm/S. Z:400 mm/S. R :300°;
Solder Feeding Speed: 1~50mm/S;
Control Mode: Teach Pendant;
Max. PCB Size(mm): X500/Y300/Z100mm;
Solder Wire: 0.6~1.2mm Solder Wire;
Repeate Accuracy: +-0.02mm;
Temperature Range: 0-500℃;
Driving Mode: Step Motor;
Air Pressure: 4.5~6kg/Cm2;
Weight: Approx:65kg;
Power Supply: AC:220 +-10%,50/60Hz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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