| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Product Name: Development Board;
Model Number: Orange Pi 4A;
Chipest: Allwinner T527;
RAM: 2GB/4GB Lpddr4/4X;
Emmc: 16GB/32GB/64GB/128GB (Optional);
Spi Flash: 128MB(Default)\256MB (Optional);
Onboard Network: 10/100/1000Mbps Ethernet;
Power Source: Type-C 5V 5A Dcin;
Supported OS: Ubuntu/Debian/Android13;
PCB: 89*56*1.6mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: Orange Pi Compute Module 4;
Model Number: Single Board Computer;
RAM: 1GB/2GB/4GB/8GB (Lpddr4/4X);
Chipest: Rockchip Rk3566;
Pmu: Rockchip Rk809-5;
Wi-Fi + Bluetooth: Wi-Fi 5+Bt 5.0,BLE (20u5622);
PCB: 55X40mm;
Weight: 12g;
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