| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4high Tg Fr4,General Tg Fr4,Middle Tg Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Min.Line Width: 0.15mm;
Min.Hole Size: 0.1mm;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Layer: 1-24 Layers;
Copper Thickness: 0.5-6.0oz;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: Jx-PCBA;
Brand: Customer's Brand;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Minimum Mechanical Drilling Aperture: 6mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Raw Material: FR4/Cem-1/Cem-3/FR1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue, Green, Red, Black, White., etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Ict/Fct;
Inner Packing: Vacuum;
Outer Packing: Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
SMT: 16 Lines;
SMT Module: High Speed Module;
DIP: 6 Lines;
IC: BGA;
IC Type: Qfn;
SMD: 01005;
Spi: 100% Passed;
Aoi: 100% Passed;
X-ray: 100% Passed;
Ict: 100% Passed;
Programming: Yes;
Function Testing: 100% Passed;
Packages: Yes;
Shipping: by Air;
Shipping Method: by Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: up to 32 Layers;
PCB Shape: Any Shape;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 500* 1200mm;
Min.Drilled Hole Size: 0.2mm;
Min.Line Width: 0.05mm(2mil);
Min.Line Spaceing: 0.05mm(2mil);
Surface Finish: HASL/Hhasl Lead Free, Chemical Tin, Chemical etc;
Copper Thickness: 1/20z, 10z, 20z, 30z;
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