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Multilayer PCB
US$0.50-3.00 / Piece
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What is Custom Motherboard Production PCBA Main Board Assembly Multilayer PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 Pieces US$3.00

100-999 Pieces US$1.50

1,000+ Pieces US$0.50

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Cem-1,Aluminium
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification Customized
  • Trademark Smart
  • Origin Guangdong, China
  • Min Drill Hole Diameter 0.010.1mmor 10 Mil
  • Number of Layers 2/4/6/8/12/14orcustom
  • Single Gross Weight Kg
  • Copper Thickness 0.5-6.0oz
  • Board Size Custom
  • PCB Cutting Shear V-Score, Tab-Routed
  • Min Trace/Gap 0.075mm or 3mil
  • Board Thickness 0.2-4.0mm

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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Multilayer PCB Comparison
Transaction Info
Price US$0.50-3.00 / Piece US$1.20-1.80 / Piece US$1.20-1.80 / Piece US$1.10-1.80 / PCS US$1.10-1.80 / PCS
Min Order 5 Pieces 1 Piece 1 Piece 1 PCS 1 PCS
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/14orcustom;
Single Gross Weight: Kg;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 16;
Board Thickness: 3.2mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: Controlled Impedance;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 16;
Board Thickness: 3.2mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: Controlled Impedance;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier