| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer Counts: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Roger;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T≥0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/Space: 0.075mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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