| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Color: Green, Yellow, Black, White, Red, Blue;
Copper Thickness: 0.5oz, 1.0oz, 2oz, 3oz or Custom;
Surface Finishing: HASL, Lead Free HASL, Imm Gold, OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
|