| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Stiffener: Without, Top, Bot, Both Sides;
Board Thickness: 0.13-0.3mm;
Solder Mask(Coverlay): Yellow, White, Black;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Insulation Layer Thickness: 25μm;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Insulation Layer Thickness: 25μm;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Insulation Layer Thickness: 25μm;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Red Light Therapy FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Bohaiming;
Insulation Layer Thickness: 25μm;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
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