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Multilayer PCB
US$0.80-3.00 / pieces
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What is Smart Electronics Professional Custom PCB Printed Circuit Boards Making Quick Turn Small PCB Multilayer PCB Manufacturer

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$3.00

100-999 pieces US$1.60

1,000+ pieces US$0.80

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Aluminium
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong, China
  • Copper Thickness 0.5-6.0oz
  • Min.Hole Size 0.1mm
  • Min.Line Spacing 0.075mm
  • Solder Mask Green, Red, Blue, Yellow Black, White etc
  • Min. Line Width 0.15mm
  • Board Size Custom
  • Board Thickness 0.2-4.0mm
  • Surface Finishing HASL, Lead Free

Product Description

Products Description PCB Capacities and Technical Specification Order Quantity 1-500,000 Layer 1, 2, 4, 6, up to 24 layer Material FR-4, High Tg, Isola, Aluminum, Rogers, etc PCB type Rigid, flexible, rigid-flexible Shape Rectangular, round, slots, cutouts, complex, irregular Max PCB ...

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Multilayer PCB Comparison
Transaction Info
Price US$0.80-3.00 / pieces US$141.00-143.00 / Piece US$54.00 / Piece US$55.00 / Piece US$6.80 / Piece
Min Order 5 pieces 100 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask: Green, Red, Blue, Yellow Black, White etc;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lead Free;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 2.25;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.74;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.17;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier