| Specification |
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Silkscreen: White, Black;
Number of Layers: 4-Layer;
Copper Thickness: 1oz;
Product Name: Single Layer PCB or 1-24 Layers PCB;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.075mm;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
MOQ: 5PCS;
Min. Line Width: 0.15mm;
PCBA Service: Turnkey Assembly PCBA Service;
Components Sourcing: Yes;
Surace Treaunent: Hasllf HASL, Imm Goiamm Sver, USP etc;
Board Size: Custom;
Board Thickness: 1.6mm;
Surface Finishing: Custom;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCBA Manufacturer;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days; PCBA, 2-3weeks;
Servicve: PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Product Name: PCB Board Coupler Transister;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: EEG;
Keyword: Custom PCB;
Price: Factory Price;
Service: 7*24 Hours Online;
Delivery: 24hours~5 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 4;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 2;
Surface Finish: Immersion Gold;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
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