| Specification |
Condition: New;
Warranty: 12 Months;
Automatic Grade: Semiautomatic;
Installation: Desktop;
Driven Type: Electric;
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Function: High Temperature Resistance;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Pneumatic;
Mould Life: >1,000,000 Shots;
Applicable Wire Diameter: φ15 ~ φ50μm (Gold or Copper);
Maximum Bonding Area: X: 56mm, Y: 80mm;
Repeatability: ±3μm (@ 3-Sigma);
Position Accuracy: ±3μm (@ 3-Sigma);
Applicable IC Products: to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA,;
Magazine Compatibility: Length: 100 to 275 mm Width: 30 to 90mm;
Weight: 660kg;
Bonding Cycle: 45 Ms Per Wire;
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After-sales Service: Provided;
Function: High Temperature Resistance;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Product Name: Semiconductor Equipment;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
After-Sale Service: Provided;
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After-sales Service: Provided;
Function: High Temperature Resistance;
Demoulding: Automatic;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Desktop;
Driven Type: Electric;
Mould Life: >1,000,000 Shots;
Product Name: Wafer Back Grinding Equipment;
Feature 1: High Precision;
Feature 2: High Efficiency;
OEM/ODM Service: Provided;
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After-sales Service: 7*24 Hours;
Function: High Temperature Resistance, Anti-Corrosion;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Closing Pressureclosing Pressure: 98 to 1,764 kN;
Injection Pressure: 4.9 to 29.4 kN (Adjustable);
Feature 2: CCD Image Detection;
OEM/ODM Service: Provided;
Applicable Lead Frame Size: W: 20 to 90mm, L: 124 to 300mm THK: 0.15 to 1.2mm;
Applicable Plastic Sealing Material: Diameter 11 to 20 mm;
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