| Specification |
Application: Diode, Power Electronic Components, Temperature Measurement, Power Supply, AC/DC Motor Control, Soft Start, etc;
Batch Number: 2024+;
Manufacturing Technology: Discrete Device;
Material: Power Semiconductor;
Model: MFC300;
Package: SMD;
Signal Processing: Digital;
Type: Intrinsic Semiconductor;
Quality: Guarantee;
Customized: Yes;
Feature: Easy to Install and International Standard Packing;
Cooling: Water-Cooling or Air-Cooling;
Service: High;
Price Term: Fob/CPT/EXW/CIF;
Delivery Time: 3-7 Days;
Delivery Port: Tianjin, China;
Brand: Sailton;
Applications: AC/DC Motor Control/Soft Start/Power Supply, etc.;
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Application: Diode, Refrigerator;
Batch Number: 2016;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Model: Mbr30200CT;
Package: PGA(Pin Grid Array Package);
Signal Processing: Analog Digital Composite and Function;
Type: Intrinsic Semiconductor;
Current: 5.0;
Peake Reverse Voltage: 40;
Brand: Sy;
Ifsm: 250;
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Application: Diode, Refrigerator;
Batch Number: R2000;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Element Semiconductor;
Model: R2000;
Package: PGA(Pin Grid Array Package);
Signal Processing: Analog Digital Composite and Function;
Type: Intrinsic Semiconductor;
Brand: Sy;
Kv: 15;
Ma: 100;
Ifsm: 25;
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Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100Ω;
Front Side: Polished;
Backside: Etched;
Diameter: 200±0.2mm;
Thickness: 725±25mm;
Oxide Thickness: 40000A;
Ttv: ≤25μm;
Warp: ≤40μm;
Bow: ≤40μm;
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Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100Ω;
Front Side: Polished;
Backside: Etched;
Diameter: 150±0.3mm;
Thickness: 675±25mm;
Oxide Thickness: 40000A;
Ttv: ≤10μm;
Warp: ≤30μm;
Bow: ≤30μm;
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