| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Mulitilay Layer PCB: 140mm*210 mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Abis;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Pth Wall: 20um Min;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Surface: OSP, Immersion Gold, Hal Lead Free, Hal;
Solder Mask: Green, Red, Yellow, White, Black, Blue, etc;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Surface: OSP, Immersion Gold, Hal Lead Free, Hal;
Solder Mask: Green, Red, Yellow, White, Black, Blue, etc;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Layer: 1-32;
Finish Copper: 1-6 Oz;
Board Thickness: 0.15-6.0mm;
Solder Mask: Green/Red/Blue/Black/Purple/Yellow/Orange;
Silk Screen: White/Black;
Surface Finish: Enig/HASL/HASL Lf/OSP/Immersion Tin;
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