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Advantech Embedded Edge Computing Platform Compact Embedded Box Ipc with Intel? Celeron? J641 Uno-2372g V2 Uno-2372g-J231ae J6412 Processor

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 piece US$435.00-1,000.00 / piece

Sepcifications

  • Application Factory, Warehouse, Outdoor Edge
  • Instruction System Intel? Core?
  • Max. CPUs 0
  • Number of CPu Threads 4
  • Server Form Factor 2U
  • Storage Capacity >1TB
  • Supporting Memory Capacity Other
  • System Architecture Non-X86 Server
  • Form Factor 2U
  • Management Interface Dme
  • Network Connectivity 1GbE
  • Operating System Windows Server
  • Power Supply Redundant PSU
  • Processor Type Other
  • RAM Capacity 64GB
  • Storage Type Hybrid Storage(Combination of HDDs and SSDs)
  • Transport Package Carton
  • Specification 44×42×44
  • Origin China
  • Category Compact Embedded Box Ipc
  • CPU Intel? Celeron? J6412 (Elkhart Lake)
  • Memory 8GB DDR4 (up to 32GB)
  • I/O 4 X COM (RS-232/422/485), 2 X Gbe LAN, 4 X USB
  • Display 1 X HDMI (4K), 1 X Dp (4K)
  • Ingress IP40 (Base Unit)
  • Contidion Brand New

Product Description

Product Description UNO-2372G V2 As of 2026, the UNO-2372G V2 (UNO-2372G-J231AE) is Advantech's current-generation modular embedded IPC, featuring an Intel Elkhart Lake processor. Below are the core specification tables derived from official documentation. I/O Interfaces Key I/O interfaces include ...

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Uno-2372g-J231ae Pic Comparison
Transaction Info
Price US$435.00-1,000.00 / piece US$1,000.00-4,286.00 / Piece US$1,000.00-4,286.00 / Piece US$1,299.00-2,599.00 / Piece US$899.00-2,999.00 / Piece
Min Order 1 piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union, Small-amount payment LC, T/T, D/P LC, T/T, D/P LC, T/T, D/P T/T, D/P, PayPal
Quality Control
Management System Certification - Others Others Others -
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, Africa Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Factory, Warehouse, Outdoor Edge;
Instruction System: Intel® Core™;
Max. CPUs: 0;
Number of CPu Threads: 4;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: Other;
System Architecture: Non-X86 Server;
Form Factor: 2U;
Management Interface: Dme;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Other;
RAM Capacity: 64GB;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Category: Compact Embedded Box Ipc;
CPU: Intel® Celeron® J6412 (Elkhart Lake);
Memory: 8GB DDR4 (up to 32GB);
I/O: 4 X COM (RS-232/422/485), 2 X Gbe LAN, 4 X USB;
Display: 1 X HDMI (4K), 1 X Dp (4K);
Ingress: IP40 (Base Unit);
Contidion: Brand New;
Application: Enterprise Level;
Max. CPUs: 2;
Number of CPu Threads: 4;
Supporting Memory Capacity: 6tb;
System Architecture: X86 Server;
Workstation Type: Desktop Workstation;
Server Type: Rack;
Hard Disk Capacity: 1tb;
Platform: PC Workstation;
Application: Enterprise Level;
Max. CPUs: 2;
Number of CPu Threads: 4;
Supporting Memory Capacity: 6tb;
System Architecture: X86 Server;
Workstation Type: Desktop Workstation;
Server Type: Rack;
Hard Disk Capacity: 1tb;
Platform: PC Workstation;
Application: Enterprise Level;
Instruction System: CISC;
Max. CPUs: 1;
Server Form Factor: 1U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 1U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: 64GB;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Weight: Max:13.1kg;
Processor: up to Two 3rd Generation Intel Xeon Scalable CPU;
Memory: 32 DDR4 DIMM Slots Speeds up to 3200 Mt/S;
Drive Bays: up to 10 X 2.5-Inch Sas/SATA/Nvme (HDD/SSD) 153 Tb;
Power Supplies: 800-1400W;
Cooling Options: Air Cooling, Optional Processor Liquid Cooling;
Dimensions: 42.8*482*772mm;
Embedded Nic: 2 X 1 Gbe Lom;
Network Options: 1 X Ocp 3.0 (X8 Pcie Lanes);
GPU Options: up to Three 75 W Single-Width GPU;
Pcie: up to 3 X Pcie Gen4 Low Profile Slots;
Application: Department Level;
Instruction System: CISC;
Max. CPUs: 2;
Server Form Factor: 2U;
Storage Capacity: >1TB;
Supporting Memory Capacity: >1TB;
System Architecture: X86 Server;
Form Factor: 2U;
Management Interface: iDRAC;
Network Connectivity: 1GbE;
Operating System: Windows Server;
Power Supply: Redundant PSU;
Processor Type: Intel Xeon;
RAM Capacity: 64GB;
Storage Type: Hybrid Storage(Combination of HDDs and SSDs);
Processor: up to 2 Gen4 or Gen5 Intel Xeon CPU;
Memory: 32 DDR5 DIMM Slots, Supports Rdimm 8 Tb Max;
Front Drive Bays: up to 8 X 2.5-Inch Sas/SATA/Nvme, Max 122.88 Tb;
Cooling Options: Air Cooling;
Embedded Nic: 2 X 1gbe Lom Card (Optional);
Pcie: up to Twelve Pcie Slots (X16 Connector);
GPU Options: up to 4 Dw GPU or 12 Sw GPU;
Network Options: 1 X Ocp Card 3.0 (Optional);
Product Dimensions: 86.8*482*946.73mm;
Supplier Name

Beijing Fengyuan Tengda Technology Co., Ltd

Gold Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Liaoning Sicheng Technology Co., Ltd.

Diamond Member Audited Supplier

Shenyang Baida Zhicheng Technology Co., Ltd.

Diamond Member Audited Supplier