| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Min. Hold Size: 0.2mm;
Min. Line Width: 0.075mm;
Surface Finishing: Immersion Gold, OSP, HASL Lf;
Soldermask Color: Green, Blue, Red, White, Yellow;
Certificates: RoHS, ISO, Ts, UL;
Board Thinckness: 0.2-5.0mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Min. Hold Size: 0.2mm;
Min. Line Width: 0.075mm;
Surface Finishing: Immersion Gold, OSP, HASL Lf;
Soldermask Color: Green, Blue, Red, White, Yellow;
Certificates: RoHS, ISO, Ts, UL;
Board Thinckness: 0.2-5.0mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Min. Hold Size: 0.2mm;
Min. Line Width: 0.075mm;
Surface Finishing: Immersion Gold, OSP, HASL Lf;
Soldermask Color: Green, Blue, Red, White, Yellow;
Certificates: RoHS, ISO, Ts, UL;
Board Thinckness: 0.2-5.0mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 1-50u'';
Layers: 1-20layers;
Copper Thickness: 0.5-8oz;
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