| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polyimide;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc;
Silkscreen Color: White, Yellow, Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Mobile Phone, Smart Sensor Modules;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Flexible PCB;
Keywords: Flexible FPC PCB for Sensor;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.2mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.1mm;
Layer Count: 1-12 L;
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Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Keywords: Multilayer PCB;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.1mm;
Layer Count: 1-50 L;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Keywords: Multilayer PCB;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.1mm;
Layer Count: 1-50 L;
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