| Specification |
Metal Coating: Gold;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Min. SMD Size: 01005;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
Service: One-Stop Service;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4;
Surface Finish: Immersion Gold;
Sodermask: Green;
Silk-Screen: White;
Thickness: 0.8-17.5mm;
Finish Copper: 2oz;
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Metal Coating: Stainless Steel;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Modle: Mr-700;
Max Stencil Size: L1000*W700*H1730(mm);
Liquid Tank: 40L;
Clean Time: 2-5min;
Dry Time: 2-5min;
Compressed Air Pressure: 0.5~0.7MPa;
Air Flow Rate: 400~600L/Min;
Clean Method: 360°Rotation Spray Clean + Compressed Air Blow;
Filter System: 20um/10um/5um, 3 Level;
Machine Weight: 230kg;
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Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi, Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Tg: Tg130-Tg180;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Green;
Silk: White;
Surface Finish: HASL;
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