| Specification |
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: CEM-2;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Tail Lift;
Mechanical Rigid: Fexible;
Material: Copper-Based;
Brand: Beauway;
Product Name: Circuit Board;
Model Number: 12V/24V;
Function: Rise/Fall/Flip;
Description: Power Unit for Lifting Tailgate;
Transmission Mode: Wireless;
Color: Yellow/Green;
Place of Origin: Anhui, China;
Package / Case: PCB;
Condition: 100% Brand New;
Packaging Type: Carton;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: CEM-2;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Tail Lift;
Mechanical Rigid: Fexible;
Material: Copper-Based;
Brand: Beauway;
Product Name: Circuit Board;
Model Number: 12V/24V;
Function: Rise/Fall/Flip;
Description: Power Unit for Lifting Tailgate;
Transmission Mode: Wireless;
Color: Yellow/Green;
Place of Origin: Anhui, China;
Package / Case: PCB;
Condition: 100% Brand New;
Packaging Type: Carton;
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Type: Rigid Circuit Board;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Silkscreen Color: Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
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Type: Rigid Circuit Board;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Silkscreen Color: Green/Black/Red Customized;
Board Color: White/Green/Black/Red/Blue Customized;
Min Track and Spacing: ≥3/3mil(0.076mm);
Min Network Track and Spacing: ≥6mil/8mil(0.15/0.20mm);
Min Hole(Drilling Machine): Min 0.2mm, Tolerance ±0.075mm;
Min Slot(Drilling Machine): 0.6mm, Tolerance±0.1mm;
Surface Treatment: HASL, HASL Lead Free, Enig, Immersion AG, Immersio;
Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/M·K Available;
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