| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey;
Service: Turnkey Assembly PCB Service;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregula;
Board Thickness: 0.4-5.0mm;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base, Teflon;
Order Qty: Not Limited;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Customized: Customizable;
Min. SMD Size: 01005;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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