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Price
Min. Order Reference FOB Price
1 Piece US$0.01-0.03 / Piece
Sepcifications
- Type Combining Rigid Circuit Board
- Flame Retardant Properties V1
- Dielectric CEM-1
- Base Material Aluminum
- Insulation Materials Metal Composite Materials
- Processing Technology Delay Pressure Foil
- Application Medical Instruments
- Mechanical Rigid Rigid
- Material Paper Phenolic Copper Foil Substrate
- Brand Okey
- Transport Package Inner Vacuum Packing and Outer by Cartons
- Specification FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
- Trademark OKEY
- Origin Guangdong Shenzhen, China
- Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
- Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
- Layer 1-60 Layers
- Service Turnkey Assembly PCB Service
- Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
- Copper Thickness 1-10oz
- Min. SMD Size 01005
- QA Inspection QA Inspection and Ect.
- Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
- Order Qty No Limited
- Condition New
- Controlling Range -40c~125c
- Solder Resist Color Green;Red;Yellow;Black;White and Ect.
- Surface Finishedc HASL, Gold Finger, OSP, Enig, Peelable Mask
- Trade Mark OEM, ODM
Product Description
Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...
