| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: AIN;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ;
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Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Polyimide;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Fiberglass Epoxy;
Brand: Uc;
Layer: 1;
Surface Treatment: Enig;
Ipc Standards: Ipc-Class 2;
Size: 500*8mm;
Board Thickness: 0.15-0.2mm;
PCB Testing: Flying Probe Testing/E-Testing;
Solder Mask Color: White;
Screen Color: Black;
Lead Time: 7+ Working Days;
Fast Turn: 3+ Working Days;
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