| Specification |
Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Test: 100% Ict Test;
Thickness: 17.5mm;
Service: One-Stop Turnkey PCBA Service;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Test: 100% Ict Test;
Thickness: 17.5mm;
Service: One-Stop Turnkey PCBA Service;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Measurement Principle: Sine White Projection PMP Inspection;
Lens Resolution: 42mmx42mm (Based on 6. 5 M Pixel / 16.5um Resoluti;
Accuracy: Xy(Resolution):±1um;
Inspection Speed: 0.45 Sec/Fov;
Mark-Point Detection Time: 0.5sec/Piece;
Max.PCB Size: 510*460mm;
PCB Thickness: 0.3 ~ 6.0mm;
PCB Warpage: ±2.0mm;
PCB Weight: 4kg;
PCB Height: Top:50mm;
Conveyor Height: 900±20mm;
Conveyor Direction: L ~R or R ~L;
Power: AC220 50/60Hz,5A;
Compressed Air: 0.4 ~ 0.6MPa;
Weight: 1100kg;
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