| Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: Circuit PCBA Board;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Automobile Flexible PCBA Board;
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Metal Coating: Copper;
Mode of Production: SMT and DIP;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-18 Layer;
Copper Thickness: 0.5oz-6oz;
Board Thickness: 0.2mm-4mm;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Consumer, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: PCBA/PCB Assembly/PCB Circuit Board;
Other Service: PCB/PCB Layout and Design, Engineering Support;
PCB Assembly Name: ISO9001 PCB Assembly Control Board PCBA;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4,Tg;
Customized: Customized;
Condition: New;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Supplier Type: Manufacturer;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Customized: Customized;
Condition: New;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/14 or Custom;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
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