| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Specified Types: 3-5s Li-ion/Li-Polymer/LiFePO4 Battery;
I-Ion/Li-Polymer Charging Voltage: 12.6V-21V;
LiFePO4 Charging Voltage: 10.8V-18V;
Max. Continuous Charging Current: 20A(Max);
Maximal Continuous Discharging Current: 20A(Max);
Discharge Overcurrent Protection: 50±10A(Can Adjust);
Colour of PCM: Green;
Balance: Yes;
Warranty: 12 Months;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Specified Types: 3-4s Li-ion/Li-Polymer/LiFePO4 Battery;
L-Ion/Li-Polymer Charging Voltage: 12.6V-16.8V;
LiFePO4 Charging Voltage: 10.8V-14.4V;
Max. Continuous Charging Current: 12A(Max);
Maximal Continuous Discharging Current: 12A(Max);
Discharge Overcurrent Protection: 30±5A(Can Adjust);
Colour of PCM: Red;
Balance: Yes;
Warranty: 12 Months;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Customized;
PCB Layer: 4 Layers;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: Accepted;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 12-15 Days;
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Metal Coating: Copper;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
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