| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
PCBA Specialised: Consumer, Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Electronic PCBA PCB Circuit Board Assembly;
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Metal Coating: Gold;
Mode of Production: SMT and DIP;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
PCBA Specialised: Consumer, Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Electronic Component PCB Board Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Specified Types: 5-16s Li-ion/Li-Polymer/LiFePO4 Battery;
L-Ion/Li-Polymer Charging Voltage: 21V-67.2V;
LiFePO4 Charging Voltage: 18V-57.6V;
Max. Continuous Charging Current: 200A(Max);
Maximal Continuous Discharging Current: 200A(Max);
Discharge Overcurrent Protection: 800±200A(Can Adjust);
Colour of PCM: Green;
Balance: Yes;
Warranty: 12 Months;
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