| Specification |
Metal Coating: Enig, Engpig, Immresion Tin, Immersion Silver;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: Fr4 Tg170 It180A;
Customized: Customized;
Condition: New;
Copper Thickness: 0.5-12 0z;
Min.Hole Size: 0.1mm;
Min.Line Width: 3mil;
Fastest Delivery Time: 24 Hours (Sample);
Min.Line Spacing: 3mil;
Board Thickness: 0.2-7.0mm;
Surface Finishing: Hal, Enigosp, Immersion Tin/Silver, Hard Gold;
Impedance Control: Yes;
Selective Hard Gold: Yes;
Gold Fingers: Yes, 30u" 50u";
Service: PCB+PCBA+Components+Reverse Engineer;
Heavy Copper: up to 12 Oz;
Aspect Ratio: 20:1;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Qta(Quick Turn Around): Yes;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Layer: 1-32;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Orange;
Silk: White;
Surface Finish: Enig;
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Metal Coating: Enig / HASL / OSP / Silver etc;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Enig / HASL / OSP / Silver etc;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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