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Mu Star High-Density Multilayer PCB Prototype Assembly Electronic Components for Medical PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$30.00

1,000-2,999 Pieces US$10.00

3,000-4,999 Pieces US$7.00

5,000+ Pieces US$5.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Mu Star
  • Transport Package DHL, FedEx, UPS, EMS
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Product Name PCB Circuit Board PCBA
  • MOQ 1PCS
  • Layers 1-64 Layers
  • Board Thickness 0.4mm-10.0mm
  • Copper Thickness 1-10oz
  • Solder Mask Color White.Black.Yellow.Green.Red.Blue
  • Surface Finishing HASL(Lead-Free), Enig, Immersion Gold, Immersion T
  • Service PCB, Components, PCBA, SMT, DIP, Testing Service
  • Certificate ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD Mu Star High-Density Multilayer PCB Prototype Assembly Electronic Components For Medical PCBA Our Advantage: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. ...

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Medical PCBA Comparison
Transaction Info
Price US$5.00-30.00 / Piece US$0.90-2.60 / Piece US$5.60 / Piece US$52.00 / Piece US$17.00 / Piece
Min Order 1 Piece 1 Piece 500 Pieces 500 Pieces 500 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mu Star;
Product Name: PCB Circuit Board PCBA;
MOQ: 1PCS;
Layers: 1-64 Layers;
Board Thickness: 0.4mm-10.0mm;
Copper Thickness: 1-10oz;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC , Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.16;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.09;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.43;
Supplier Name

Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

JS Technology Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier