| Specification |
Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: Customized;
Surface Finishing: HASL;
Type: Smart Electronics PCBA;
Solder Mask: White Black Green Blue Red;
SMT Capacity: 7 Million Points/Day;
DIP Capacity: 5 Million Points/Day;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Substrate: Fr4, Cem1, Cem3;
PCB Layer Count: 1 Layer, 2 Layer, Multilayer PCB;
Copper: 1oz, 2oz, 3oz;
Soldermask: Green, Blue, White, Black, Red;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Substrate: Fr4, Cem1, Cem3;
PCB Layer Count: 1 Layer, 2 Layer, Multilayer PCB;
Copper: 1oz, 2oz, 3oz;
Soldermask: Green, Blue, White, Black, Red;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Substrate: Fr4, Cem1, Cem3;
PCB Layer Count: 1 Layer, 2 Layer, Multilayer PCB;
Copper: 1oz, 2oz, 3oz;
Soldermask: Green, Blue, White, Black, Red;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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