| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-5;
Customized: Customized;
Condition: New;
Supplier Type: OEM / ODM;
PCBA Service: PCBA Contract Manufacturing;
Solder Mask Color: Green, Black, Blue, White;
PCB Assembly: SMT, DIP;
Trade Terms: Fob, Ex-Works;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-5;
Customized: Customized;
Condition: New;
Supplier Type: OEM / ODM;
PCBA Service: PCBA Contract Manufacturing;
Solder Mask Color: Green, Black, Blue, White;
PCB Assembly: SMT, DIP;
Trade Terms: Fob, Ex-Works;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: CEM-2;
Customized: Customized;
Condition: Used;
MOQ: No Required;
Delivery Term: 7-15days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Processing Technology: Electrolytic Foil;
Flame Retardant Properties: V0;
Material: Polyester Glass Fiber Mat Laminate;
Insulation Materials: Epoxy Resin;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: CEM-2;
Customized: Customized;
Condition: Used;
MOQ: No Required;
Delivery Term: 7-15days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Processing Technology: Electrolytic Foil;
Flame Retardant Properties: V0;
Material: Polyester Glass Fiber Mat Laminate;
Insulation Materials: Epoxy Resin;
Surface Treatment: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
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