| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM;
Copper Thickness: 1/2oz 1oz 2oz 3oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.075mm;
Surface Finishing: HASL/OSP/Enig;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Conductive Type: Unipolar Integrated Circuit;
Integration: Ulsi;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Shape: Round;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Conductive Type: Unipolar Integrated Circuit;
Integration: Ulsi;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 50 Layer;
Thicnkness Board: 1.6mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
File: PCB File;
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