| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rck;
Service: One Stop Turnkey PCBA Service;
Test: 100%Test;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Minimum Line/ Space: 3mil/ 0.075mm;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: Kappa 438;
Material: Glass Reinforced Hydrocarbon Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Kappa 438;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 40mil;
Layer Count: 2-Layer;
Application: Distributed Antenna Systems;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: RF-35A2;
Material: PTFE Ceramic Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold,Immersion Silver;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 10mil, 20mil, 30mil and 60mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Power Amplifier;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc;
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