| Specification |
Type: LED Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4, Polyimide, Aluminum;
Insulation Materials: Organic Resin;
Board Type: Rigid, Flex, Rigid-Flex PCB;
Layer Count: 1 - 32 Layers;
Board Thickness: 0.2 mm - 3.2 mm;
Board Thickness Tolerance: ±10% (Min ±0.03 mm);
Finished Copper Weight: 0.5 Oz - 6.0 Oz (18-210 μm);
Min Line Width / Space: 0.05 mm / 0.05 mm (2 Mil);
Min Hole Size: 0.15 mm (6 Mil);
Surface Finish: Enig, HASL, OSP, Immersion Silver;
Solder Mask Color: Green, Blue, Black, White, Red;
Impedance Control: ±8% (50 ω, 100 ω Differential);
Operating Temperature Range: -40 °C to +130 °C;
Flammability Rating: UL 94V-0;
Dielectric Constant (Dk): 3.8 - 4.5 @ 1 GHz;
Testing Standard: 100% Aoi & Flying Probe Test;
Certifications: ISO 9001, IATF 16949, UL, RoHS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
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