| Specification |
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
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Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics /Lot /New Energy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kq;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Quality Test: Aoi, 100% E-Test;
Condition: New;
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Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics /Lot /New Energy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Organic Resin;
Brand: Kq;
Layers: 1-32 Layers;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig /0sp /Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Solder Mask Color: Green /Black/White /Red/Blue /Yellow;
Condition: New;
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Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics /Lot /New Energy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kq;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Quality Test: Aoi, 100% E-Test;
Condition: New;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl, Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min.Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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