| Specification |
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Polyimide;
Board Thickness: 1.6 Mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Polyimide;
Board Thickness: 1.6 Mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
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Structure: Single-Sided FPC;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumeric;
Copper Thickness: 1/1/1/1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: Yellow;
Silk Screen: Orange;
Surface Treatment: HASL Lead Free;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Thickness: 0.1-1mm;
Mask Color: Red, Green, White, Yellow;
Maxium Size: 600*1200mm;
Board Thickness: 0.20mm-8.00mm;
Surface Finish: HASL, Enig, Chen. Tin, Fash Gold, Asp, Gold Finger;
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