| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics / IoT / New Energy;
Layers: 1-32 Layers;
Material: Fr-4/High Tg Fr-4/Aluminum/Ceramic/Copper/Hal;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL/Enig/0sp/Immersion Silver /Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness /Board Thickness: 0.50z/10z/20z/30z/40z;
Solder Mask Color: Green /Black/White /Red /Blue /Yellow;
Mechanical Rigid: Rigid/Flex/Rigid-Fle;
Condition: New;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Product Name: HDI PCB;
Keywords: HDI PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Product Name: Rigid-Flex PCB;
Keywords: Rogers Rigid Flex PCB for Aerospace Radar;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc.;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 2-20L;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Product Name: HDI PCB;
Keywords: HDI PCB;
Surface Finishing: Enig, HASL,OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
|
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Communication;
Base Material: Fr4+Pi;
Surface Finish: Enig;
Layers: 2 Layers;
Solder Mask: Green;
Legend: White;
Accept Custom: Yes;
|