| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
Max. PCB Size: 22inch*22inch or 550mm*550mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Copper Thickness: 18um-210um(6oz);
Profiling Punching: Routing, V-Cut, Beveling;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
Service: PCB, Components Sourcing and in-House;
|
Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
|
Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
|
Structure: Single-Sided Rigid PCB;
Dielectric: FR-1;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
|
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-30 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
|