| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Copper Base;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Component Packing: Tary, Tube, Tape;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
PCB Silkscreen Color: Black, White, Yellow;
Number of Layers: 1-32;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Service: One-Stop Turnkey;
Maximum Board Size: 640mm*1100mm;
PCB Board Thickness: 0.2mm-6.0mm;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
Minimum Mechanical Drilling Aperture: 6mil;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Layer: 1-20 Layers;
Color: Green or as Your Requirement;
Max Copper: 6oz;
Max Thickness: 6mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: PP,Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Minimum Line/ Space: 0.075mm;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Subtractive Process;
Base Material: RO4533;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Dielectric Constant: 3.3;
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Structure: Multilayer Rigid PCB;
Dielectric: Rt Duroid 5880lz;
Material: Unique Filled PTFE Composites;
Application: Stripline and Microstrip;
Flame Retardant Properties: V0;
Processing Technology: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Production Process: Subtractive Process;
Base Material: Rt Duroid 5880lz;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 10mil 20mil 50mil and 100mil;
Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid;
Dielectric Constant: 2;
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