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Custom PCB Assembly
US$0.05-16.00 / Piece
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Custom PCB Assembly for Android Smartphones - Expert Design Services

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$16.00

10-99 Pieces US$9.00

100-999 Pieces US$0.90

1,000+ Pieces US$0.05

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China
  • Certification ISO 9001/ 14001
  • Test Aoi/Spi
  • Inner Packing Plastic
  • Outer Packing Carton

Product Description

About us Jingxin PCBA Electronic Technology Co.ltd Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the ...

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Custom PCB Assembly Comparison
Transaction Info
Price US$0.05-16.00 / Piece US$130.00 / Piece US$0.60 / Piece US$30.00 / Piece US$60.00-80.00 / Square Meter
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Square Meter
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification ISO 9001/ 14001 - - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi;
Inner Packing: Plastic;
Outer Packing: Carton;
Type: Taconic Material;
Dielectric: Tel-35;
Material: RF-35;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: RF-35;
Aluminum PCB Board: 260mm*40mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Type: Rigid Circuit Board;
Dielectric: RF-60;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Telfon PCB: 190mm*185mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Xjy;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Layer: 2;
Solder Mask: Green;
Legend Mask: White;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier